Copper is incredibly destructive when it's in the wrong part of the fab. It's such a problem that most manufacturers typically separate it across physical cleanroom boundaries and use things like skybridges to move the wafers from one to the other. Once a lot touches the copper area, there's no coming back. It's basically a zombie virus.
The motivation seems easy though, wafers cost a lot of money! No one wants to see low yields. They are constantly testing and measuring everything to try and find root causes. Look at some of these diagrams if something can be isolated they try to do it.
https://spectrumnews1.com/oh/columbus/news/2025/02/28/intel-...