I think they used block quantization: one can enumerate all possible blocks for all (sorted) permutations of coefficients and for each layer place only these blocks that are needed there. For 3-bit coefficients and block size of 4 coefficients only 330 different blocks are needed.
Matrices in the llama 3.1 are 4096x4096, 16M coefficients. They can be compressed into only 330 blocks, if we assume that all coefficients' permutations are there, and network of correct permutations of inputs and outputs.
Assuming that blocks are the most area consuming part, we have block's transistor budget of about 250 thousands of transistors, or 30 thousands of 2-inputs NAND gates per block.
250K transistors per block * 330 blocks / 16M transistors = about 5 transistors per coefficient.
Looks very, very doable.
It does look doable even for FP4 - these are 3-bit coefficients in disguise.
Other than the obvious costs (but Taalas seems to be bringing back the structured ASIC era so costs shouldn't be that low [1]), I'm curious why this isn't getting much attention from larger companies. Of course, this wouldn't be useful for training models but as the models further improve, I can totally see this inside fully local + ultrafast + ultra efficient processors.
Imagine a slot on your computer where you physically pop out and replace the chip with different models, sort of like a Nintendo DS.
(Still compelling!)
But sure, the next generation could be much smaller. It doesn't require battery cells, (much) heat management, or ruggedization, all of which put hard limits on how much you can miniaturise power banks.
I doubt it would scale linearly, but for home use 170 tokens/s at 2.5W would be cool; 17 tokens/s at 0,25W would be awesome.
On the other hand, this may be a step towards positronic brains (https://en.wikipedia.org/wiki/Positronic_brain)
Infact, I was thinking, if robots of future could have such slots, where they can use different models, depending on the task they're given. Like a Hardware MoE.
Models would be available as USB plug-in devices. A dense < 20B model may be the best assistant we need for personal use. It is like graphic cards again.
I hope lots of vendors will take note. Open weight models are abundant now. Even at a few thousand tokens/second, low buying cost and low operating cost, this is massive.
For dense LLMs, like llama-3.1-8B, you profit a lot from having all the weights available close to the actual multiply-accumulate hardware.
With MoE, it is rather like a memory lookup. Instead of a 1:1 pairing of MACs to stored weights, you suddenly are forced to have a large memory block next to a small MAC block. And once this mismatch becomes large enough, there is a huge gain by using a highly optimized memory process for the memory instead of mask ROM.
At that point we are back to a chiplet approach...
They use Optical Circuit Switches, operating via MEMS mirrors, to create highly reconfigurable, high-bandwidth 3D torus topologies. The OCS fabric allows 4,096 chips to be connected in a single pod, with the ability to dynamically rewire the cluster to match the communication patterns of specific MoE models.
The 3D torus connects 64-chip cubes with 6 neighbors each. TPUv4 also contains 2 SparseCores which specialize handling high-bandwidth, non-contiguous memory accesses.
Of course this is a DC level system, not something on a chip for your pc, but just want to express the scale here.
*ed: SpareCubes to SparseCubes
I feel printing ASIC is the main block here.
Perhaps mask manufacturers?
From some announcements 2 years ago, it seems like they missed their initial schedule by a year, if that's indicative of anything.
For their hardware to make sense a couple of things would need to be true: 1. A model is good enough for a given usecase that there is no need to update/change it for 3-5 years. Note they need to redo their HW-Pipeline if even the weights change. 2. This application is also highly latency-sensitive and benefits from power efficiency. 3. That application is large enough in scale to warrant doing all this instead of running on last-gen hardware.
Maybe some edge-computing and non-civilian use-cases might fit that, but given the lifespan of models, I wonder if most companies wouldn't consider something like this too high-risk.
But maybe some non-text applications, like TTS, audio/video gen, might actually be a good fit.
I didn't explore the actual manufacturing process.
The single transistor multiply is intriguing.
Id assume they are layers of FMA operating in the log domain.
But everything tells me that would be too noisy and error prone to work.
On the other hand my mind is completely biased to the digital world.
If they stay in the log domain and use a resistor network for multiplication, and the transistor is just exponentiating for the addition that seems genuinely ingenious.
Mulling it over, actually the noise probably doesn't matter. It'll average to 0.
It's essentially compute and memory baked together.
I don't know much about the area of research so can't tell if it's innovative but it does seem compelling!
However, [1] provides the following description: "Taalas’ density is also helped by an innovation which stores a 4-bit model parameter and does multiplication on a single transistor, Bajic said (he declined to give further details but confirmed that compute is still fully digital)."
[1] https://www.eetimes.com/taalas-specializes-to-extremes-for-e...
Some would call it a multi-gate transistor, whilst others would call it multiple transistors in a row...
"Large Parameter Set Computation Accelerator Using Memory with Parameter Encoding" [2]
"Mask Programmable ROM Using Shared Connections" [3]
The "single transistor multiply" could be multiplication by routing, not arithmetic. Patent [2] describes an accelerator where, if weights are 4-bit (16 possible values), you pre-compute all 16 products (input x each possible value) with a shared multiplier bank, then use a hardwired mesh to route the correct result to each weight's location. The abstract says it directly: multiplier circuits produce a set of outputs, readable cells store addresses associated with parameter values, and a selection circuit picks the right output. The per-weight "readable cell" would then just be an access transistor that passes through the right pre-computed product. If that reading is correct, it's consistent with the CEO telling EE Times compute is "fully digital" [4], and explains why 4-bit matters so much: 16 multipliers to broadcast is tractable, 256 (8-bit) is not.
The same patent reportedly describes the connectivity mesh as configurable via top metal masks, referred to as "saving the model in the mask ROM of the system." If so, the base die is identical across models, with only top metal layers changing to encode weights-as-connectivity and dataflow schedule.
Patent [3] covers high-density multibit mask ROM using shared drain and gate connections with mask-programmable vias, possibly how they hit the density for 8B parameters on one 815mm2 die.
If roughly right, some testable predictions: performance very sensitive to quantization bitwidth; near-zero external memory bandwidth dependence; fine-tuning limited to what fits in the SRAM sidecar.
Caveat: the specific implementation details beyond the abstracts are based on Deep Research's analysis of the full patent texts, not my own reading, so could be off. But the abstracts and public descriptions line up well.
[1] https://www.nextplatform.com/2026/02/19/taalas-etches-ai-mod...
[2] https://patents.google.com/patent/WO2025147771A1/en
[3] https://patents.google.com/patent/WO2025217724A1/en
[4] https://www.eetimes.com/taalas-specializes-to-extremes-for-e...
Taalas of course builds base chips that are already closely tailored for a particular type of models. They aim to generate the final chips with the model weights baked into ROMs in two months after the weights become available. They hope that the hardware will be profitable for at least some customers, even if the model is only good enough for a year. Assuming they do get superior speed and energy efficiency, this may be a good idea.
If the chip is designed as the article says, they should be able to do 1 token per clock cycle...
And whilst I'm sure the propagation time is long through all that logic, it should still be able to do tens of millions of tokens per second...
Talas promises a 10x higher throughtput, being 10x cheaper and using 10x less electricity.
Looks like a good value proposition.
Current open weight models < 20B are already capable of being useful. With even 1K tokens/second, they would change what it means to interact with them or for models to interact with the computer.
dwata: Entirely Local Financial Data Extraction from Emails Using Ministral 3 3B with Ollama: https://youtu.be/LVT-jYlvM18
Wow. Massively ignorant take. A modern GPUs is an amazing feat of engineering, particularly about making computation more efficient (low power/high throughput).
Then proceeds to explain, wrongly, how inference is supposssedly implemented and draws conclusions from there ...
I had written this post to have a higher level understanding of traditional vs Taalas's inference. So it does abstracts lots of things.